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TSMC and Samsung Adopt ASML Next-Gen EUV Tech to Fuel AI Boom

The Daily Upside Read original source (opens in a new tab)
The Story

News Summary

  • ASML secured agreements with TSMC and Samsung to adopt its next-generation High-NA EUV lithography systems by 2028 and 2030.
  • The move solidifies ASML's monopoly on advanced chipmaking equipment and guarantees long-term manufacturing roadmaps for next-generation AI processors and high-end mobile chips.
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