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Intel Surges on High-NA EUV Milestone, Widening Lead Over TSMC and Pressure on AMD

24/7 Wall St. Read original source (opens in a new tab)
The Story

News Summary

  • Intel and ASML confirmed over one million wafers processed using High-NA EUV lithography for Panther Lake production.
  • With rivals TSMC and Samsung delaying adoption until 2028–2030, Intel gains a multi-year lead in next-generation chipmaking, mounting competitive pressure on fabless rivals like AMD.
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